64000

sqm of plant area

30

production lines of SMT

8

lines of wave soldering

15

lines of Box Build

4000

global staff

1,500K

POS Terminals per Month

All of the above make it possible to provide comprehensive support for ODM and offer high-quality yet cost-efficient production services.

Extensive production management experience. Able to provide high-quality, high-precision, and highly efficient production capacity.

Latest Technology and Infrastructure &
Leading Expertise

Normal process capability covers

  • the smallest chip 01005
  • all kinds of BGA
  • PCB sized up to 1068mm*710mm
  • 30 Layers board
  • POP, Flip Chip, Glue and Underfill etc.

Special process capability includes

  • Conformal Coating
  • Potting and etc.

Comprehensive Testing to Rest Your Mind

In Process Test

3D Solder Paste Inspection
Automatic Optical Inspection
X-Ray Inspection
In Circuit Test
First Article Inspection

Reliability Test

Environmental Stress Test
Thermal Shock
Salt Spray Test
Vibration Test
Drop Test

Functional Test

Automatic Test Equipment line
Customized Functional Test
Lab View